“In the semiconductor manufacturing industry, a direct cooler is usually used to control the temperature of the process reaction chamber (ie, the wafer chuck). The existing direct coolers usually use conventional compressors, which not only consume a large amount of energy, but also have poor temperature control accuracy, which cannot meet the requirements of high-precision semiconductor production.
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The patent of Zhongke Xinyuan’s semiconductor direct cooler uses a semiconductor temperature control chip to control the temperature of the reaction chamber, which significantly improves the temperature control accuracy and energy consumption.
According to the micro-net news, Zhongke Xinyuan is the only leader in the application of high-power thermoelectric temperature control systems in China. improve.
In the semiconductor manufacturing industry, a direct cooler is usually used to control the temperature of the process reaction chamber (ie, the wafer chuck). The existing direct coolers usually use conventional compressors, which not only consume a large amount of energy, but also have poor temperature control accuracy, which cannot meet the requirements of high-precision semiconductor production.
To this end, Zhongke Xinyuan applied for an invention patent on January 11, 2019 called “heat exchanger and direct cooler for temperature control of semiconductor equipment reaction chamber” (application number: 201910026792.2), application The person is Jiangsu Zhongke Xinyuan Semiconductor Technology Co., Ltd.
Figure 1 Schematic diagram of the structure of the heat exchanger
Figure 1 is a schematic structural diagram of a heat exchanger, that is, a single-unit heat exchanger, including a cooling chip, a heat dissipation block and a heat exchange plate, wherein the cooling chip includes a number of cooling modules, and the cooling modules include P-type and N-type materials. Both ends of the N-type and N-type materials are connected by metal conductors respectively.
The cold end of the cooling chip is connected to the reaction chamber, the surface of the hot end is connected to the base of the heat dissipation block, and the heat dissipation surface of the heat dissipation block is connected to the cooling liquid inside the heat exchange plate. The cooling chip works when powered on (two pins of the cooling chip are turned on), a positive voltage applied to the N-type material drives electrons from the P-type to the N-type material and back to the voltage source. At this point, the temperature of the cold end decreases as the heat is absorbed, and then the heat is conducted to the hot end and dissipated through the heat sink. If the voltage is reversed, the above process is also reversed. The temperature control accuracy and energy consumption of the refrigeration chip for temperature control of the reaction chamber are significantly improved.
When the heat exchanger includes two cooling chips electrically connected in parallel, a heat exchange plate is shared between adjacent cooling chips, that is, the two sides of the heat exchange plate are respectively connected to the heat dissipation surfaces of the two heat dissipation blocks; The ends are respectively connected to the reaction chamber. Its working principle is the same as that of a single-unit heat exchanger; its circuit is set according to the parallel relationship, and its cooling effect can be adjusted.
When the heat exchanger includes twelve cooling chips electrically connected in series, that is, the heat exchange plate is provided with six cooling chips connected in series, among which there are two heat exchange plates in a parallel relationship, so there are twelve cooling chips in total. The hot end surface of the cooling chip is connected to one side of the heat dissipation block, and the heat dissipation surface of the heat dissipation block is respectively connected to the cooling liquid inside the heat exchange plate; and the cold end of the cooling chip is connected to the reaction chamber. Its working principle is still the same as that of a single-unit heat exchanger; its circuit is set according to the series relationship, and its cooling effect can be adjusted; and the number of cooling chips can be increased or decreased according to actual needs to further optimize the cooling effect.
Figure 2 Schematic diagram of the liquid cooling channel structure
FIG. 2 is a schematic structural diagram of a liquid cooling channel. The heat exchange plate in any of the above heat exchangers is provided with a liquid cooling channel, and the liquid cooling channel is immersed in the heat dissipation surface of the heat dissipation block. The heat dissipation surface is a plurality of parallel and parallel heat dissipation plates. The two ends of the side of the heat exchange plate are respectively provided with a water inlet and a water outlet, and there is a liquid cooling channel in between. The liquid cooling channel is immersed in the space between the periphery of the heat dissipation block and the heat dissipation surface. The cooling liquid in it can quickly take away the heat from the heat dissipation surface. The heat exchange plate is provided with an installation port, and one side of the installation port is connected to the cooling liquid. The other side is connected to the heat dissipation block, the heat dissipation surface of the heat dissipation block is immersed in the cooling liquid, and a sealing ring is provided on the connection surface between the installation port and the base of the heat dissipation block. The sealing ring separates the cooling liquid from the cooling chip, ensuring water tightness.
In short, Zhongke Xinyuan’s semiconductor direct cooler patent uses semiconductor temperature control chips to control the temperature of the reaction chamber, which significantly improves the temperature control accuracy and energy consumption.
Zhongke Xinyuan is a provider of thermoelectric temperature control system products and solutions. Its core team has nearly 20 years of work experience in the semiconductor field and is in an absolute leading position in the competition of similar products in the semiconductor industry. Looking forward to the future, Zhongke Xinyuan will continue to explore and expand the current research field and market with the semiconductor field as its moat.
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