April 5, 2020, Guangzhou, China – Guangdong Gowin semiconductor Technology Co., Ltd. (hereinafter referred to as “Gowin Semiconductor”), the world’s fastest growing programmable logic company, has won the EU CE- BLE (Bluetooth Low Energy Radio) module. RED (Radio Equipment Directive) certification allows developers to quickly and easily integrate the GW1NRF-4 µSoC FPGA BLE module into final products.
At the end of 2019, Gowin Semiconductor released the first GW1NRF-4 FPGA with an integrated BLE module), which provides 4.6k LUTs, integrates a 32-bit low-power ARC processor and a Bluetooth BLE module, and is packaged as 6x6mm QFN. In order to provide customers with more complete solutions, GOWIN Semiconductor is producing certified GW1NRF BLE modules, enabling customers to easily and quickly design end products.
Wireless ICs are typically offered by semiconductor manufacturers in two forms. Some developers need to integrate the Bluetooth chip into their own system board. In this case, developers need to certify their overall board functionality for Bluetooth in the corresponding area of their end product, which allows for more flexibility in chip integration, but usually adds additional certification costs to the end product manufacturer . Another option is to integrate an already certified PCB module. This module contains the Bluetooth module and other required circuits such as decoupling capacitors, oscillators and antennas. This way, customers can integrate pre-certified PCB modules onto larger system boards without having to re-certify the rest of the system.
“Compared to the pure GW1NRF-4 Bluetooth FPGA chip, many customers are more inclined to request a certified GW1NRF-4 module,” said Grant Jennings, International Marketing Director of GOWIN Semiconductor. “Customers want to do Bluetooth in different countries/regions. Functional certification may bring huge cost and technical burden. Therefore, GOWIN Semiconductor provides pre-certified GW1NRF-4 Bluetooth low energy modules, which saves customers the burden of certification and enables customers to easily design products. “
“Gowin Semiconductor has always been committed to providing customers with complete solutions,” said Huang Jun, Vice President of Marketing and China Sales Director of Gowin Semiconductor, “Module products based on GW1NRF-4 Bluetooth FPGA will greatly reduce the development difficulty of customers and reduce The use threshold of customers, this module is highly integrated, and it also provides enough flexibility to facilitate users to flexibly develop terminal products, which can effectively shorten the TIME-TO-MARKET time. This module has passed Bluetooth-related certification, customers No need to incur certification costs.”
GOWIN Semiconductor GW1NRF-4 Bluetooth module is a 19x20mm module, which includes GW1NRF-4 device, related passive components, crystal oscillator and antenna, this module provides “plug and play” for products with FPGA and Bluetooth functions. ” implementation.
GOWIN Semiconductor recently demonstrated the GW1NRF-4 BLE-enabled FPGA at Embedded World 2020, and will continue to develop more reference designs and demo demos around this device to quickly provide users with Bluetooth FPGA capabilities.