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Dalian Dayoushang Group launched a 3D object gripping system solution based on Intel products
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“The leading semiconductor components distributor dedicated to the Asia-Pacific market, Dalianda Holdings, announced ...

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NXP has reached a strategic cooperation with GAC Research Institute and Continental Group to create the world’s leading new generation of intelligent connected products
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Guangzhou, China – September 10, 2021 – NXP (China) Management Co., Ltd. (hereinafter referred to as “NXP”) recently signed a contract with GAC Research ...

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Apple supplier Qorvo acquires two more UWB chip and RF companies
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According to foreign media reports, Apple supplier Qorvo has acquired UWB chip supplier Decawave in a transaction valued at $400 million for the acquisition ...

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3D Machine Vision Windshield Embedded System Improves Operational Accuracy and Speed
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“According to foreign media reports, Bluewrist is committed to the development and promotion of robotic arms and ...

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Which EV technology is stronger?Understand the solutions of these semiconductor manufacturers, you will understand
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“Under the sustainable development scenario, electric vehicles (EVs) play a key role in reducing carbon emissions and ...

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